《厦门大学学报（自然科学版）》

对微结构精密加工时需要能够控制高低不平的材料去除,以保证不破坏原有微结构的三维形貌特征.通过自行搭建的实验平台对3D打印出来的微结构工件进行抛光实验,主要研究了机床主轴转速、加工间隙、抛光时间和抛光路径等工艺参数对微结构抛光后的三维轮廓材料去除特性以及微结构的保形情况.实验结果表明:微结构保形系数随着抛光时间增加而变小,而主轴转速和加工间隙的变化对保形系数影响较小; 采用等高线移动式抛光的保形系数比采用水平移动式大; 相同工艺参数抛光对包体状和截面为半圆的圆环圆周阵列微结构工件保形效果较好,对正三棱锥工件保形效果较差.

In the precision processing of microstructures,the uneven material removal must be skillfully controlled such that the original three-dimensional morphology of the microstructure is not destroyed.The test platform for 3D printed microstructure work-piece polishing is established.Effects of spindle speed,machining gap,polishing time and polishing path on microstructure conformal polishing and three-dimensional profile removal characteristics are primarily studied.Experimental results show that the conformal coefficient decreases with the increase of polishing time,while the change of spindle speed and machining gap exerts little effect on the conformal coefficient.The method of contour line moving polishing exhibits greater conformal coefficients than the horizontal moving counterpart does.The conformal effect is better for the microstructure work linear array with hemispheroid and circular array with rings,the section of which is semicircle,but not for triangular pyramid workpiece.

引言
1 实验条件与设计
2 实验结果与分析
3 结论

图1 MCF抛光实验装置<br/>Fig.1 Experimental equipment of MCF polishing

图1 MCF抛光实验装置
Fig.1 Experimental equipment of MCF polishing

图2 3D打印微结构工件<br/>Fig.2 The workpiece of 3D printed microstructure

图2 3D打印微结构工件
Fig.2 The workpiece of 3D printed microstructure

表1 抛光工艺参数<br/>Tab.1 Experimental parameters of polishing

表1 抛光工艺参数
Tab.1 Experimental parameters of polishing

图3 等高线移动式抛光示意图<br/>Fig.3 Schematic diagram of contour line moving polishing

图3 等高线移动式抛光示意图
Fig.3 Schematic diagram of contour line moving polishing

图4 显微镜2 000倍率下检测到的抛光前后表面形貌<br/>Fig.4 The surface texture before and after polishing observed at the 2 000 magnification

图4 显微镜2 000倍率下检测到的抛光前后表面形貌
Fig.4 The surface texture before and after polishing observed at the 2 000 magnification

图5 微结构的表面轮廓
Fig.5 The surface profile of microstructure

图6 不同工艺参数对包体状微结构抛光表面的实际R值<br/>Fig.6 The actual R volues of inclusion microstructure workpiece at different process parameters

图6 不同工艺参数对包体状微结构抛光表面的实际R值
Fig.6 The actual R volues of inclusion microstructure workpiece at different process parameters

表2 各工艺参数抛光后微结构的k值<br/>Tab.2 The k volues of microstructure workpiece after polishing at different process parameters

表2 各工艺参数抛光后微结构的k值
Tab.2 The k volues of microstructure workpiece after polishing at different process parameters

图7 两种抛光路径微结构表面材料实际R值<br/>Fig.7 The actual R values of microstructure workpiece at two polishing paths

图7 两种抛光路径微结构表面材料实际R值
Fig.7 The actual R values of microstructure workpiece at two polishing paths

图8 两种抛光路径抛光后微结构的k值<br/>Fig.8 The k values of microstructure workpiece at two polishing paths

图8 两种抛光路径抛光后微结构的k值
Fig.8 The k values of microstructure workpiece at two polishing paths

图9 3种微结构工件抛光后的材料实际R值<br/>Fig.9 The aceual R values of three kinds of microstructure workpieces after polishing

图9 3种微结构工件抛光后的材料实际R值
Fig.9 The aceual R values of three kinds of microstructure workpieces after polishing

图10 3种微结构工件抛光后的k值<br/>Fig.10 The k values of three kinds of microstructure workpieces after polishing

图10 3种微结构工件抛光后的k值
Fig.10 The k values of three kinds of microstructure workpieces after polishing

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备注

引言

1 实验条件与设计

2 实验结果与分析

3 结论

学报简介

备注

引言

1 实验条件与设计

2 实验结果与分析

3 结 论

学报简介

3 结论