氮氧化铝的原子层沉积制备及其阻变性能研究

(厦门大学物理科学与技术学院,福建 厦门 361005)

原子层沉积; AlNxOy薄膜; 阻变存储器; 双极型

AlNxOy Film Prepared by Atomic Layer Deposition and Its Research in Resistive Random Access Memory
LIU Yu,YU Jue,HUANG Wei*,LI Jun,WANG Jianyuan,

(College of Physics Science and Technology,Xiamen University,Xiamen 361005,China)

DOI: 10.6043/j.issn.0438-0479.201703001

备注

以等离子体增强原子层沉积(PE-ALD)技术生长氮氧化铝(AlNxOy)薄膜,磁控溅射Ag上电极制备结构为Ag/AlNxOy/Pt的阻变存储器(RRAM).器件呈现双极性阻变特性,正向开启电压稳定且分布窄,变化幅度集中在0.5 V的范围内.高阻态和低阻态电阻之比超过103,并具有免激活特性.低温测试表明,器件的低阻态电阻和温度正相关,说明了阻变的机制为银导电细丝的形成和断裂.

AlNxOy film deposited by plasma-enhanced atomic layer deposition(PE-ALD)and Ag electrode sputtered by magnetron sputtering are used to fabricate resistive random access memory(RRAM)devices with a structure of Ag/AlNxOy/Pt.The device can be resistively switched in the bipolar mode with the set voltages distributed in a narrow range of 0.5 V.The high/low resistance ratio lies beyond 103.The device is also found to be electroforming-free.Low-temperature I-U measurement show that the resistance of the ohmic low resistance state is positively proportional to the temperature,suggesting the metallic filament property.The switching mechanism of the device is explained by the formation and therupture of the Ag filaments in AlNxOy films.

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